Soichi Inoue

Lithography Technology, Mask Technology, Optical Inspection and Measurement Technology

Immediately after joining the company, I was engaged in X-ray microscope development as a basic research to study the potential of X-ray lithography mask inspection technology. Thereafter, I established optical lithography modeling and design techniques to optimize patterning performance and achieve stable production. I also led the world's first practical application of model-based OPC (Optical Proximity Correction) technology to improve pattern fidelity. These technologies continue to evolve daily and are still in continuous use today. In recent years, I have worked on the development of EUVL (Extreme Ultraviolet Lithography), NIL (Nanoimprint Lithography), and NDM (Nano-Defect Management) technologies. In the future, going back to measurement technology, the starting point of my career, I would like to develop high-resolution observation techniques for 3D nano-structures of advanced semiconductor devices.