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UFS 3.1
for Consumer & Industrial
UFS: Boosting Performance in Demanding Applications
Designed to be the next-generation of higher performance embedded storage after e-MMC, KIOXIA’s Universal Flash Storage (UFS) brings ultra high-speed read/write performance, low power consumption and quick application launch times demanded by a wide range of digital consumer products.
UFS has a serial interface, which reduces the number of signal pins, simplifying routing. It also supports full duplex operation, enabling simultaneous reading and writing between the host processor and the UFS device. This boosts overall system performance and improves the performance of mobile devices.
KIOXIA’s UFS solutions are compliant with JEDEC/UFS Version 3.1, and integrate the company’s BiCS FLASH™ 3D flash memory with a controller in a JEDEC-standard package.
Key Features of KIOXIA UFS (Universal Flash Storage)
- Serial Interface
- High Speed Reads/Writes
- Low pin count
- 256GB, 512GB
- 11 x 13mm and 11.5 x 13mm 153ball BGA package
- JEDEC Standard
Next Generation UFS 4.0 (UFS version 4.0)
UFS 4.0 offers lightning fast embedded storage transfer speeds allowing next-generation smartphones and mobile applications to take advantage of 5G mobile networks. UFS 4.0 incorporates MIPI M-PHY 5.0 High-Speed Gear 5 and UniPro2.0, and supports theoretical interface speeds of up to 23.2Gbps per lane or 46.4Gbps per device. UFS 4.0 is backward compatible with UFS 3.1 so existing platforms can use the latest generation of Flash Memory technology used in UFS 4.0, while incorporating all of the existing UFS 3.1 features.
Two Types of Managed Flash by Bus Interface
KIOXIA offers UFS and e-MMC, a family of high-capacity Flash Memories with an integrated controller. These Flash Memory solutions provide ECC and other control functions that are optimized for each Flash Memory technology generation. UFS and e-MMC reduce the workload on the host processor, simplify product development, shorten time-to-market and increase ease of use memory products.
Compared to e-MMC, UFS Delivers:
- A faster interface
- Higher performance for reads and writes
- Higher density options
- Support for full duplexing
- Better power efficiency
Management Feature includes Bad Block Management, Wear Leveling and Garbage Collection.
KIOXIA UFS Key Technology
WriteBooster Functionality
WriteBooster enhances write performance by utilizing the existing user data area as a temporary SLC buffer without sacrificing capacity. Maximum SLC buffer size can be configured by the host at device configuration and the host can keep writing data to the buffer until the buffer is filled.
This feature is enabled dynamically during operation by the host depending on system performance requirements of 5G and other applications.
Host Performance Booster (HPB)
HPB Ver. 2.0 improves random read access performance by caching logical to physical translation tables (L2P table) from the device to the host side memory, and the host can initiate read operation along with L2P table so the device can simply read out data from the physical address provided by the host.
This feature can enhance random read access over wide-range addresses, which usually results in a performance drop due to multiple table updates in the device.
Advanced Technology
KIOXIA UFS utilizes high-performance BiCS FLASH™ 3D flash memory technology to optimize performance.
Density Range and Packaging
UFS devices are available in densities up to 1TB* in a range of package sizes. UFS meets the demands of applications that store large amounts of data, pictures and video.
- as of August, 2022
KIOXIA UFS Key Applications
Notebook / Ultrabook™ / Tablet / Desktop PC / Gaming PC
Smartphone / Smartwatch / Smart glasses
Game console / Smart TV / Virtual Reality Headsets / Set-Top-Box/Digital Video Recorder / Smart speaker / Smart home / Wearables / Home Health / Home Network
Automation / Digital Healthcare / Transportation / Surveillance / Robot / Drone / Security / Digital Signage / Networking (5G area network) / PoS (Point of Sales)
Learn and Evaluate
UFS 3.1 Spec
*Table can be scrolled horizontally.
| Capacity | Part Number | UFS Version |
Max Data Rate (MB/s) |
Supply Voltage | Operating Temperature (℃) |
Package Size (mm) |
||
|---|---|---|---|---|---|---|---|---|
| VCC (V) |
VCCQ (V) |
VCCQ2 (V) |
||||||
| 256GB | THGJFGT1E45BAIP | 3.1 | 2320 | 2.4 to 2.7, 2.7 to 3.6 |
1.14 to 1.26 | - (1) | -25 to 85 | 11.0x13.0x0.8 |
| 512GB | THGJFGT2T85BAIU | 11.0x13.0x1.0 | ||||||
- This product supports dual-supply operation at VCC and VCCQ. VCCQ2 need not be supplied.
UFS 4.0
KIOXIA's UFS 4.0 offers lightning fast embedded storage transfer speeds allowing next-generation smartphones and mobile applications to take advantage of 5G mobile networks.
Support
Please contact us if you have any technical questions, requests for materials, are interested in samples or purchases of business products (Memory, SSD), etc.
In 2007, KIOXIA announced the world‘s first 3D flash memory technology. Presenting our cutting-edge technologies, along with the key points of innovation and our efforts toward further increases in capacity.
KIOXIA invented the world’s first NAND flash memory in 1987. This is an explanation of the structure of flash memory and the mechanism of data storage.
“Multi-level cell technology” is one of the main technologies realizing larger capacity flash memory. The 1 Gbit MLC NAND flash memory launched by KIOXIA in 2001 was the first application in the world of multi-level cell technology to a NAND flash memory product.
