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Technology Topics
Introducing the latest technologies being researched and developed at KIOXIA Corporation and various use cases of flash memories.
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We have studied with Mie University to improve the accuracy of wafer map(data representation showing which chips on a wafer are defective) classification, which is used to investigate the causes of defects in the semiconductor manufacturing process. The method devised in this joint research was presented at the AEC/APC Symposium Asia 2023.
R&D Organization
We aim to pursue continuous technological exploration and its social implementation to achieve an affluent and sustainable digitalized society through innovative memory technologies.
Conducts R&D on BiCS FLASH™, a type of 3D flash memory that KIOXIA was the first to develop in the world, while serving as a bridge between R&D and volume production.
KIOXIA memory and storage solutions enable the success of emerging applications and allow existing technologies to reach their expected potential.
Storage technologies and solutions that support the latest SSDs, such as software-defined solutions that share SSDs across security networks, are introduced.
KIOXIA has established industry-leading R&D frameworks with “memory” technology. We use our various locations to conduct technological innovation while promoting open innovation.
