Event Report: FMS 2024 - KIOXIA Spotlights Flash Solutions Shaping the Future of Storage

KIOXIA was proud to be an Executive Premier Sponsor continuing from last year at the Future of Memory and Storage (FMS) event, the world's largest event on flash memory and its applications, held in Santa Clara, California, USA, in August 2024. KIOXIA highlighted how its breakthrough flash memory solutions are driving advancements and improvements in hundreds of applications across a wide range of market segments – from AI, IoT, and automotive to data centers, the cloud and the edge. FMS 2024 was the ideal venue to showcase how KIOXIA’s innovative flash memory solutions drive progress across diverse sectors.

Key highlights at the event included KIOXIA’s 2 Tb QLC flash memory featuring BiCS FLASH™ generation 8 3D flash memory technology as well as NVMe™ SSDs enabling AI workloads and KIOXIA’s SSD-Based RAID Offload technology.

KIOXIA highlighted how customers can upgrade, create, and innovate their products and solutions with KIOXIA at the show.

Keynote: KIOXIA - Advancement in flash memory technologies to unleash the power of AI

Atsushi Inoue, vice president and technology executive for KIOXIA Corporation’s Memory Division, and Neville Ichhaporia, senior vice president and general manager of the SSD business unit for KIOXIA America, Inc. helped kick off the event with the first keynote.

FMS 2024 Keynote: KIOXIA - Advancement in flash memory technologies to unleash the power of AI (Video, 41:31)
Atsushi Inoue, vice president and technology executive for KIOXIA Corporation’s Memory Division, spoke about our flash memory technology innovation and started the first keynote at FMS 2024.
Neville Ichhaporia, senior vice president and general manager of the SSD business unit for KIOXIA America, highlighted SSDs, AI, and opportunities.
KIOXIA's first keynote was well received and attended.
During the keynote Neville was joined on stage by Rob Davis, VP at NVIDIA, who helped reinforce how KIOXIA solutions are supporting AI fast growing market.

Awards Report

KIOXIA Corporation’s Development Team was honored with the FMS Lifetime Achievement Award. Acknowledging the pioneering work in creating and commercializing 3D flash memory, this award celebrates past achievements and underscores KIOXIA’s role as a leader in the ongoing development of flash memory technology.

Ryota Katsumata, senior fellow of the Advanced Memory Development Center for KIOXIA accepted the Lifetime Achievement Award on behalf of the engineering team (the second from the right).

KIOXIA’s SSD-based RAID offload technology was recognized with an FMS ‘Best of Show’ award in the ‘Most Innovative Technology’ SSD technology category. Kioxia’s SSDs with RAID Offload provide a standards-based, host-orchestrated scale out and sustainable solution to offload RAID parity compute. This frees up valuable host CPU, memory and cache resources that can now be used to accelerate primary applications. This can significantly improve performance, reduce system cost, and increase power efficiency in server and storage systems.

KIOXIA won ‘Best of Show’ award for SSD-Based RAID Offload Technology at FMS 2024.
From right to left, Shigenori Yanagi, technology executive, SSD Division, Devesh Rai, Sr. Staff Strategic Marketing Manager, Neville Ichhaporia, Senior Vice President and General Manager, and Mahinder Saluja, Director of Strategic Marketing accepted the 'Best of Show' award at FMS 2024.

KIOXIA Booth

KIOXIA’s 2024 booth demos included:

  • BiCS FLASH™ generation 8 3D flash memory: Display showing CMOS Bonded Array (CBA) architecture and a lateral density model.
  • KIOXIA CM7 Series E3.S Enterprise NVMe™ SSDs: Live demo running a BaM*1 workload and highlighting the EDSFF (Enterprise and Datacenter Standard Form Factor).
  • KIOXIA Optical NVMe™ SSD technology: Demonstration of a new prototype broadband SSD with an optical interface, to replace the traditional electrical drive interface, designed for next-generation data centers.
  • KIOXIA CD8P Series Data Center SSDs: Live demo running AiSAQ ANN*2 search for AI.
  • KIOXIA XD7P Series E1.S Data Center SSDs: Demo of Live Migration.
  • KIOXIA CXL Solutions: Featuring BiCS FLASH™ 3D flash memory and XL-FLASH high-bandwidth, low-latency CXL solutions.
  • KIOXIA SSD-Based RAID Offload Technology: Move RAID functionality to SSDs.
  • KIOXIA Automotive UFS: Driving the future of automotive applications.
  1. BaM: Big accelerator Memory
  2. All-in-Storage ANN Search with Product Quantization
The KIOXIA FMS booth was front and center on the show floor with the primary position when attendees first enter.
The ‘Memory Maker – Make it with KIOXIA’ campaign highlights how customers can upgrade, create, and innovate with KIOXIA’s flash memory and SSD technology.
KIOXIA live demos were popular among attendees.
Attendees were excited interacting with KIOXIA representatives to learn about KIOXIA's SSD products and flash memory solutions.
Attendees had fun trying out our AI photo booth, which took a headshot of the participants and created AI-generated images.
The AI photo booth generated some fun artwork based on the headshots.
KIOXIA - Flash Memory Summit 2024 (Video, 1:41)

Thank you for joining us at this year’s 20224 Future of Memory and Storage Summit.

  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • PCIe and PCI Express are registered trademarks of PCI-SIG.
  • Other company names, product names, and service names may be trademarks of third-party companies.